会社情報代表挨拶沿革認証・特許お問い合わせ
製品製品一覧Both-Side Drilling(両面ドリリング)Multi Wire Sawing(マルチワイヤーソーイング)Single Wire Sawing(シングルワイヤーソーイング)Grinding Center(グラインディングセンター)Core Drilling(コアドリリング)Step Polishing(ステップポリシング)Vertical Grinding(バーティカルグラインディング)Nano Imprinting(ナノインプリンティング)
事業事業概要研究実績
サポートお知らせよくある質問
🇰🇷 Korean Websiteお問い合わせ
NOTICE

Saehan Nanotech Signs Precision Equipment Contract with Nati...

← Back to Notice

Saehan Nanotech Signs Precision Equipment Contract with National Research Institute

Saehan Nanotech Co., Ltd. has signed a precision equipment contract with a national research institute, delivering advanced machining systems for semiconductor and advanced materials research.

The contract includes precision grinding and wire sawing machines configured for research-grade material processing, supporting the institute's work in next-generation semiconductor substrates and advanced ceramic materials.

This contract reflects Saehan Nanotech's growing reputation as a trusted supplier of precision machine tools to Korea's leading research institutions, following the company's selection as host company for the National Nano-LED Display R&D project.

Saehan Nanotech continues to invest in R&D capabilities, maintaining an in-house research institute certified since 2009 and holding over 20 registered patents in precision machining technology.